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Foshan Risun Group Co.,Ltd is a new material enterprise committed to the application and promotion of various new material additives, integrating scientific research, sales and service, providing customers with more new material solutions and creating real value for customers. Our additives cover plastic adhesives, waterborne coatings, 3D printing materials, electronic materials, nano materials and other industries.
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Home > Products > Resins and additives for high frequency and high speed Copper Clad Laminate(CCL) > 双羟基封端聚苯醚低聚物

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双羟基封端聚苯醚低聚物

一种双羟基封端聚苯醚低聚物，反应活性高，非常适合与环氧树脂、氰酸酯和聚氨酯热固性材料进行反应。在甲苯和甲乙酮中具有优异的溶解性及低粘度。与环氧树脂反应后应用于电子封装材料，包括覆铜板，半固化片，防护涂层及各种复合材料上，可显著提高各项性能（例如耐热性，介电性能，机械性能，阻燃性，吸潮性）

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